Development Of A Fixed Abrasive Slicing Technique For Reducing Cost Of Photovoltaic Wafers

by National Renewable Energy Laboratory (nr

2021-01-11 21:08:36

This report examines a wafer slicing technique developed by Crystal Systems, Inc. that reduces the cost of photovoltaic wafers. This fixed, abrasive slicing technique (FAST) uses a multiwire bladepack and a diamond-plated wirepack; water is the coola... Read more
This report examines a wafer slicing technique developed by Crystal Systems, Inc. that reduces the cost of photovoltaic wafers. This fixed, abrasive slicing technique (FAST) uses a multiwire bladepack and a diamond-plated wirepack; water is the coolant. FAST is in the prototype production stage and reduces expendable material costs while retaining the advantages of a multiwire slurry technique. The cost analysis revealed that costs can be decreased by making more cuts per bladepack and slicing more wafers per linear inch. Researchers studied the degradation of bladepacks and increased wirepack life. Less

Book Details

File size9.69 X 7.44 X 0.14 in
Print pages68
PublisherBiblioGov
Publication date July 25, 2012
LanguageEnglish
ISBN9781249201229

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