Fundamentals of Device and Systems Packaging
by Rao Tummala 2020-12-29 19:45:04
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A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the lat... Read more
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field Less
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  • Publisher
  • Publication date
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  • ISBN
  • 1 X 1 X 1 in
  • McGraw-Hill Education
  • November 20, 2019
  • eng
  • 9781259861567
Author
Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICT...
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